Equipment features:

1. Suitable for large-scale ultra precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and effectiveness;

2. High flow spray cleaning method efficiently removes organic/inorganic pollutants such as soldering flux in the bottom gap;

3. Equipped with DI water resistance monitoring system, optional concentration real-time monitoring instrument;

4. Equipped with a chemical condensation recovery system, significantly reducing the consumption of cleaning agents and lowering usage costs;

5. The whole machine is made of corrosion-resistant SUS304 material, which can adapt to alkaline cleaning agents;

6. PLC control system, graphical operation interface in Chinese/English, easy to set, change, store and call programs.

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