Cleaning object:Cleaning of residual water washing flux before molding packaging devices such as Flip Chip, SIP, CSP, BGA, Lead Frame, etc.

Equipment features:

1. Suitable for large-scale ultra precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and effectiveness;

2. Adopting the principle of medium low pressure and high flow working design, it has the ability of economical and efficient cleaning;

3. DI water spray heating cleaning efficiently removes water-soluble soldering flux, dust, and foreign objects;

4. The whole machine is made of corrosion-resistant SUS304 material, which is durable and long-lasting;

5. The nozzle is made of SUS304 stainless steel and arranged in a dense pattern, with uniform flow at medium and low pressures;

6. PLC control system, graphical operation interface in Chinese/English, easy to set, change, store and call programs.

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