Cleaning object:Residual flux and organic/inorganic pollutants after soldering semiconductor devices such as IGBT, IPM, CSP, SIP, Flip Chip, Lead Frame, etc.
Equipment features:
1. Suitable for large-scale ultra precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and effectiveness;
2. High flow spray cleaning method efficiently removes organic/inorganic pollutants such as soldering flux in the bottom gap;
3. Equipped with DI water resistance monitoring system, optional concentration real-time monitoring instrument;
4. Equipped with a chemical condensation recovery system, significantly reducing the consumption of cleaning agents and lowering usage costs;
5. The whole machine is made of imported PP material, with high cleanliness, no dust or impurities, and can adapt to acid/alkaline cleaning agents;
6. PLC control system, graphical operation interface in Chinese/English, easy to set, change, store and call programs.
Entering the board → Isolation → Chemical pre cleaning → Chemical cleaning 1 → Chemical isolation → Wind cut isolation → DI water pre rinsing → DI water rinsing 1 → Final rinsing → Isolation → Section 1 high-pressure cold air → Section 2 high-pressure hot air → Exiting the board
| Mesh belt width | 500mm customizable large size |
| cleaning speed | 0-1500mm/min adjustable |
| Device dimensions | L3600*W1700*H1650（mm） |
| power supply | 380V 50Hz |
| Total power | About 80KW |
| Equipment weight | About 1800kg |
Mr. Zheng: 1353037731
Email: zhengweibo@bohuidg.com
Official website: www.bohuiddg.con
Headquarters Address: 4th Floor, Building A, Fubilen Industrial Park, No. 78 Chaoyang Road, Yanluo Street, Bao'an District, Shenzhen
