BH-3500CL packaging washing machine
Cleaning object:
Cleaning of residual water washing flux before molding packaging devices such as Flip Chip, SIP, CSP, BGA, Lead Frame, etc.
Equipment features:
1. Suitable for large-scale semiconductor chip high-precision online DI water cleaning system;
2. Adopting the principle of medium low pressure and high flow working design, it has the ability of economical and efficient cleaning;
3. DI water spray heating cleaning efficiently removes water-soluble soldering flux, dust, and foreign objects;
4. The whole machine is made of corrosion-resistant SUS304 material, which is durable and long-lasting;
5. The nozzle is made of SUS304 stainless steel, with an encrypted nozzle layout and uniform flow rate at medium and low pressures;
6. PLC control system, graphical operation interface in Chinese/English, easy to set, change, store and call programs.
