Cleaning object:Residual flux and organic/inorganic pollutants after soldering semiconductor devices such as IGBT, IPM, CSP, SIP, Flip Chip, Lead Frame, etc.
Equipment features:
1. Suitable for large-scale ultra precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and effectiveness;
2. Immersion cleaning method efficiently removes organic/inorganic pollutants such as soldering flux in the bottom gap;
3. Equipped with DI water resistance monitoring system, optional concentration real-time monitoring instrument;
4. Equipped with a chemical filtration and recovery system, significantly reducing the consumption of cleaning agents and lowering usage costs;
5. The whole machine is made of imported SUS304 stainless steel material, with high cleanliness, no dust or impurities, and can adapt to acid/alkaline cleaning agents;
6. PLC control system, graphical operation interface in Chinese/English, easy to set, change, store and call programs.
Entering the board → Chemical immersion tank → Chemical immersion tank → Spray rinsing tank → DI water pre rinsing tank → DI water rinsing tank → DI water essence rinsing tank → Centrifugal spin drying tank → 1-stage cold air tank → 2-stage high-pressure hot air tank → Board discharge
| Tank width | 350 * 350 * 350mm can be customized in large sizes |
| cleaning speed | 3-15 minutes/blue adjustable |
| Device dimensions | L8000*W2200*H2100（mm） |
| power supply | 380V 50Hz |
| Total power | About 75KW |
| Equipment weight | About 3000kg |
Mr. Zheng: 1353037731
Email: zhengweibo@bohuidg.com
Official website: www.bohuiddg.con
Headquarters Address: 4th Floor, Building A, Fubilen Industrial Park, No. 78 Chaoyang Road, Yanluo Street, Bao'an District, Shenzhen
