Product IntroductionETC-198N is a water-based cleaning agent developed for electronic assembly and semiconductor device soldering. This product can effectively remove various types of flux and solder paste residues after soldering. The types of cleaning products include circuit board assemblies, lead frames, discrete devices, power modules, power LEDs, flip chips, and CMOS solder paste residues after soldering.

Product Features:Has excellent material compatibility with sensitive metals such as aluminum, red copper, brass, etc. Under weakly alkaline pH conditions, it can remove various residual pollutants from soldering flux, and its extremely low foaming characteristics are suitable for various spray washing equipment.

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