Cleaning object:

1. Wire Bonding gold finger cleaning and activation.

2. Clean and activate PCBA before coating to improve surface adhesion and enhance bonding strength.

3. Clean the solder pads before PCB solder paste printing, activate the surface treatment, and enhance the solidification and adhesion of the molten tin.

4. Wafer cleaning

5. COF, Mini LED substrate cleaning before dispensing.

Equipment features:

1. Clean and activate the surface of the substrate, improve the substrate surface factor, enhance substrate adhesion, improve the qualification rate of precision products, and achieve the elimination of static electricity on the substrate surface;

2. Automatic width adjustment, adjustable processing range, adjustable height, suitable for products with fixtures;

3. During the surface treatment process, the plasma output temperature is low and does not damage the substrate;

4. Dual functionality of the product, the substrate product can automatically adjust width and have a straight through mode when no surface treatment is required;

5. Do not damage the components of the processed product.

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